Three Ways Curvy ILT Together With PLDC Improves Wafer Uniformity


This is the second blog in a three-part series on pixel-level dose correction (PLDC). The first installment was “Improving Uniformity and Linearity for All Masks” from January 29, 2025. PLDC: A new solution for improving mask and wafer uniformity Improving mask uniformity is the easiest, cheapest way to improve wafer uniformity. Uniformity is a measure of how similarly the exact same feat... » read more

Reflecting On The SPIE Advanced Lithography + Patterning Symposium 2025


The mood at this year’s SPIE Advanced Lithography + Patterning Symposium was decidedly upbeat. The outlook for business is good, due in large measure to expectations of high demand for chips, driven by artificial intelligence (AI). To realize the potential of AI, increases in chip performance and efficiency are needed, which, in turn, requires advanced patterning. In the Symposium’s technic... » read more

EUV’s Future Looks Even Brighter


The rapidly increasing demand for advanced-node chips to support everything-AI is putting pressure on the industry's ability to meet demand. The need for cutting-edge semiconductors is accelerating in applications ranging from hyperscale data centers powering large language models to edge AI in smartphones, IoT devices, and autonomous systems. But manufacturing those chips relies heavily on ... » read more

Improving Uniformity And Linearity For All Masks


When it comes to mask quality, there are two vital measurements: uniformity and linearity. Uniformity measures the consistency of the size of mask features in all occurrences across the entire mask, because different instances of the same target size can vary in size due to manufacturing variation. Linearity measures how well different sizes of shapes on the manufactured mask match their target... » read more

Takeaways From The 2024 SPIE Photomask Technology + EUV Conference


In the autumn, I had the opportunity to attend the 2024 SPIE Photomask Technology and EUV Lithography conferences, collectively referred to as PUV or sometimes BACUS, the latter a reference to the event’s early association with the BACUS organization. This is a key annual event that brings together experts and professionals in photomask technology and EUV lithography. This year’s conference... » read more

Luminary Panel Sees Progress In EUV Pellicle Adoption As Critical For EUV


A significant focus of the 2024 SPIE Photomask and EUV conference was on EUV lithography and high-numerical-aperture (high-NA) EUV lithography, offering the potential to drive resolution to new heights. These EUV solutions bring new challenges such as pellicles, mask inspection, and smaller and smaller minimum mask dimensions. Progress has been impressive, according to lithography luminary Dr. ... » read more

Luminary Panel Sees Multi-Beam Mask Writers And Curvilinear Masks Key To 193i And EUV


Attendance was up and the mood was optimistic at this year’s SPIE Photomask and EUV conference held September 29 through October 3, 2024. The optimism was apparent as well for multi-beam mask writers and curvilinear masks during the eBeam Initiative’s 15th annual reception and meeting held on October 1. In the eBeam Initiative’s annual Luminaries survey, 93% of those surveyed said that pu... » read more

Overview Of The Current State of the Development Of Curvilinear Masks


A technical paper titled "Curvilinear masks overview: manufacturable mask shapes are more reliably manufacturable" was published by researchers at D2S. The paper covers: The rationale for curvilinear masks The application of the curvilinear inverse lithography technology The state of readiness of the curvilinear mask-making infrastructure, including mask rule checking, metrology, ... » read more

High-NA EUV Lithography: Enhancing Resolution By Split Pupil Exposure (Fraunhofer, ASML)


A new technical paper titled "Resolution enhancement for high-numerical aperture extreme ultraviolet lithography by split pupil exposures: a modeling perspective" was published by researchers at Fraunhofer IISB and ASML. The open source paper published on SPIE states: "The lithographic imaging performance of extreme ultraviolet (EUV) lithography is limited by the efficiency of light diffrac... » read more

Semiconductor Photomask Market Poised For Another Year Of Growth


The semiconductor photomask market, a crucial component in chip manufacturing, is on track for another year of robust growth. This growth trajectory is supported by a series of technological advancements and market trends that continue to drive innovation in the industry. As the annual SPIE Photomask Technology Conference approaches in early October in Monterey, California, it presents an oppor... » read more

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