Will Open-Source Work For Chips?

By Brian Bailey - 30 Jun, 2016 - Comments: 2

Open source is getting a second look by the semiconductor industry, driven by the high cost of design at complex nodes along with fragmentation in end markets, which increasingly means that one size or approach no longer fits all. The open source movement, as we know it today, started in the 1980s with the launch of the GNU project, which was about the time the electronic design automation (... » read more

Think In Blocks

By Brian Fuller - 15 Oct, 2015 - Comments: 0

It always seems to come back to LEGOs, doesn’t it? Earlier this year I wrote about Google Project Ara, the so-called “LEGO” smart phone architecture unveiled in April. Project Ara uses the MIPI Alliance UniPro and M-PHY protocols as the backbone for a modular electronics architecture inside a smart phone “endoskeleton.” Using electro-permanent magnets (they don’t need a perma... » read more

Google Project Ara And The Low-Power Imperative

By Brian Fuller - 08 May, 2014 - Comments: 2

You’ve no doubt seen the slides: 50 billion Internet of Things (IoT) devices by 2020. That’s an amazing number, but consider this: What if they each draw 1W? All things begin equal, we’d have to build another 50 nuclear power plants in the world to handle that additional energy requirement. (Something tells me that outcome is unrealistic). Power takes center stage as we evolve into ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Project Ara

Will Open-Source Work For Chips?

Think In Blocks

Google Project Ara And The Low-Power Imperative