Chip Industry Week in Review

By The SE Staff - 23 May, 2025 - Comments: 0

Podcast: imec's roadmap and a one-on-one interview with the European research house's chief strategy officer. China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) c... » read more

Cooling Chips Still A Top Challenge

By Bryon Moyer - 22 May, 2025 - Comments: 0

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their functionality and their longevity. And while much of the focus has been on improving power efficiency, which reduces the rate of power ... » read more

Can Chiplets Serve Cost-Conscious Apps?

By Bryon Moyer - 17 Apr, 2025 - Comments: 0

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption. One of the main reasons for the cost increase is the need for advanced packaging when employi... » read more

Packaging With Fewer People And Better Results

By Gregory Haley - 17 Apr, 2025 - Comments: 1

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Benefits And Challenges In Multi-Die Assemblies

By Ed Sperling And Laura Peters - 02 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. To view part one of t... » read more

Big Changes Ahead For Interposers And Substrates

By Gregory Haley - 24 Mar, 2025 - Comments: 1

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and signal integrity in the most advanced computing systems. This shift is being driven by AI, high-performance computing (HPC), and next-generation communications, where the need for heterogeneous ... » read more

Using Glass As A Dielectric In Electronic Packaging

By Dick Otte - 20 Mar, 2025 - Comments: 0

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with alternative materials. To this end, glass substrates have emerged as a promising alternative with distinct benefits for semiconductor packaging. Major chipmakers, including ... » read more

What Exactly Are Chiplets And Heterogeneous Integration?

By Bryon Moyer - 20 Mar, 2025 - Comments: 1

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they're reading. But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, and heterogeneous integration comes in different guises for different people. Both t... » read more

Challenges Grow For Medical ICs

By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Linear Pluggable Optics Save Energy In Data Centers

By Bryon Moyer - 24 Feb, 2025 - Comments: 0

Linear pluggable optics (LPO) is garnering more attention as a way to quickly and efficiently move data in and out of server racks, but a lack of standards for connecting the optical modules is slowing adoption at a time when there is growing pressure to reduce power in data centers. LPO is the newest of two approaches to solving the power wall problem in data centers. Co-packaged optics (CP... » read more

← Older posts

tag: Promex