tag: Promex Industries

Advanced Packaging Moving At Breakneck Pace
By Ed Sperling And Laura Peters - 29 Jan, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. L-R: Synopsys' Roosendaal; ASE's Che... » read more

Electrifying Everything: Power Moves Toward ICs
By Gregory Haley - 23 Jan, 2025 - Comments: 0

As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

Advancing Medical Devices Through Heterogeneous Integration
By David Fromm - 23 Jan, 2025 - Comments: 0

As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time monitoring of vital signs, Implantable devices engage with the human body at the cellular level. These devices’ ongo... » read more

Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly
By Promex Industries - 18 Dec, 2024 - Comments: 0

Sensors and microelectromechanical systems (MEMS) are unlocking new design possibilities for miniature devices used in healthcare, smart systems, consumer electronics, and more. Designers need a partner experienced with Heterogenous Integration (HI) to assemble the unique components for these devices and address the complications of these integrations. In this white paper, you will learn: ... » read more

Navigating Increased Complexity In Advanced Packaging
By Gregory Haley - 17 Dec, 2024 - Comments: 1

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything from process control and in-line metrology to materials selection and multi-level testing. These assemblies are the result of ... » read more

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 1

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

Advanced Packaging Driving New Collaboration Across Supply Chain
By Gregory Haley - 24 Oct, 2024 - Comments: 0

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. Heterogeneous approaches allow companies to combine different te... » read more

New Approaches To Power Decoupling
By Bryon Moyer - 24 Oct, 2024 - Comments: 0

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. Power is a much more important factor than it used to be, especially in the era of AI. “Doing an AI search consumes 10X the power t... » read more

Emerging Technologies Driving Heterogeneous Integration
By Ed Sperling - 24 Sep, 2024 - Comments: 0

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to new architectures, new materials such as glass substrates, and a variety of new challenges. Dick Otte, president and CEO of Promex I... » read more

How Die Dimensions Challenge Assembly Processes
By Anne Meixner - 19 Sep, 2024 - Comments: 1

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To fully enable a multi-chiplet ecosystem, standardized component handling and interfaces are needed. The underlying concept is similar to LEGO blocks that simply snap together, yet it's nowhere near t... » read more

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