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CEO Outlook: 2021


The new year will be one of significant transition and innovation for the chip industry, but there are so many new applications and market segments that broad generalizations are becoming less meaningful. Unlike in years past, where sales of computers or smart phones were a good indication of how the chip industry would fare, end markets have both multiplied and splintered, greatly increasin... » read more

Wafer Prep Key To Thinning SiP


In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different functionalities into systems-in-package (SIPs). Known as heterogeneous integration (HI), this approach now drives the industry’s roadmap for advancement. SiPs enable power-efficient, high-bandwidth conne... » read more