The Week In Review: IoT

By Jeff Dorsch - 10 Mar, 2017 - Comments: 0

Products NASA this week deployed its latest Technology Educational Satellite, TechEdSat-5, from the International Space Station. The satellite, said to be about the size of a fire extinguisher, will provide wireless data communications for ISS payloads and other satellites. TechEdSat-5 has Digi XBee 802.15.4 modules from Digi International to use in the test program. Flexpoint Sensor System... » read more

The Week In Review: IoT

By Jeff Dorsch - 27 Jan, 2017 - Comments: 0

Finance Ring, which sells Internet-connected doorbells, security cameras, and other products, received another $109 million in private funding, bringing its total funding to $209 million. DFJ Growth, Goldman Sachs Investment Partners, and Qualcomm Ventures led the Series D round, with participation by Richard Branson and other existing investors. Ring says its products are available in 100 cou... » read more

The Week In Review: IoT

By Jeff Dorsch - 23 Sep, 2016 - Comments: 0

Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

The Week in Review: IoT

By Jeff Dorsch - 19 Aug, 2016 - Comments: 1

Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

Enhanced Electro-Mechanical Collaboration

By Alex Grange - 24 Mar, 2016 - Comments: 0

By Alex Grange and Linda Mazzitelli Integrating electronics into its mechanical environment comes with a number of challenges that boil down to Collision and Connectivity (does the cabinet bang against that capacitor?) and Synchronization (is mechanical designing to the latest PCB design and vice versa?). The culprit to problems that arise usually is the result of poor communications. Mod... » read more

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The Week In Review: IoT

The Week In Review: IoT

The Week In Review: IoT

The Week in Review: IoT

Enhanced Electro-Mechanical Collaboration