Security For Embedded Electronics

By Jeff Dorsch - 02 Nov, 2017 - Comments: 0

The embedded systems market is expected to enjoy steady growth in the near future—provided those systems can be adequately secured. One of the biggest challenges for embedded devices and systems, especially those employed in the [getkc id="76" comment="Internet of Things"], is adequately protecting them from increasingly sophisticated hacking. This is a new tool for criminal enterprises, a... » read more

Security: Losses Outpace Gains

By Ed Sperling - 06 Apr, 2017 - Comments: 0

Paul Kocher, chief scientist in [getentity id="22671" e_name="Rambus'"] Cryptography Research Division, sat down with Semiconductor Engineering to discuss the new threats to security, artificial intelligence and machine learning, and how to engineer a secure system. What follows are excerpts of that conversation. SE: Where are we with security? It seems that rather than getting better, thing... » read more

Securing The Cloud

By Ernest Worthman - 03 Mar, 2016 - Comments: 0

Cloud computing offers on-demand network access that is ubiquitous and convenient, with a pool of configurable computing resources such as shared networks, servers, storage, applications, and services. What makes this so attractive is these services can be provisioned and adapted to the load, with minimal management or service provider intervention. Cloud computing takes advantage of a distr... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: public key infrastructure

Security For Embedded Electronics

Security: Losses Outpace Gains

Securing The Cloud