Week in Review: IoT, Security, Autos

By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Sep, 2018 - Comments: 0

Internet of Things IBM this week launched the Watson Decision Platform for Agriculture, which combines artificial intelligence, Internet of Things technology, and cloud-based offerings, providing insights to farmers through a managed service. Among other features, growers can deploy drones to send photos to the IBM Cloud for AI-based trend analysis and detection of crop diseases. The platform ... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Jun, 2018 - Comments: 0

Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

The Week in Review: IoT

By Jeff Dorsch - 11 May, 2018 - Comments: 0

Conferences Internet of Things World 2018 takes place next week at the Santa Clara Convention Center in Silicon Valley. Executives of GE Digital, The Chamberlain Group, and UPS will be among those giving keynote addresses during the four-day conference. Monday will see pre-conference workshops, followed by three days of keynotes, presentations, and an expo floor taking in 100,000 square feet o... » read more

The Week In Review: IoT

By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

The Week In Review: IoT

By Jeff Dorsch - 02 Jun, 2017 - Comments: 0

Analysis The Internet of Trains? That’s how Siemens sees its work in railroads, utilizing Big Data analytics and Internet of Things technology. “Sensors on an Internet of Trains system monitor everything from engine temperature, to the open or closed state of doors, to vibrations on the rails, and even image data from outside of the trains using cameras,” Bernard Marr writes in this anal... » read more

The Week In Review: IoT

By Jeff Dorsch - 23 Dec, 2016 - Comments: 0

M&A TDK has agreed to acquire InvenSense for $13 a share, representing a total of $1.3 billion in cash. The transaction must be approved by InvenSense shareholders and regulatory agencies; TDK expects to wrap up the deal in the second quarter of its fiscal year ending in March of 2018 (the third quarter of the calendar year). Apple accounted for 40% of InvenSense’s revenue for the fiscal... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Rigado

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

The Week in Review: IoT

The Week in Review: IoT

The Week In Review: IoT

The Week In Review: IoT

The Week In Review: IoT