Week In Review: Manufacturing, Test

By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 03 Apr, 2015 - Comments: 0

Suppliers in the automotive semiconductor market experienced exceptional growth in 2014, according to IHS. Based on final analysis of the 2014 results, Renesas maintained its leadership position as the number one supplier in 2014, according to the rankings. “For 2015, IHS expects to see a shift among the leading suppliers in this category, given the recent merger of Freescale and NXP, two lar... » read more

IoT’s Potential In Japan

By Joanne Itow - 11 Dec, 2014 - Comments: 0

Going to Semicon Japan was a real treat this year. The event was held at a new location, the weather was sunny, and the exhibits/presentations were engaging. During my walks around the exhibit floor I was drawn to the metrology and material characterization tools. Those booths seemed to have the most interesting information to share. Talking with companies like Rigaku provided insight into the ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Rigaku

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing

IoT’s Potential In Japan