The Week In Review: Design


Tools Mentor released the latest version of its FloTHERM CFD software for electronics cooling simulation, adding a new design window to create and solve variants of a model with features to improve scenario definition and design space exploration. Other enhancements include support for Phase Change Materials, more abilities for PCB designs, and an improved parallel solver. Markets IC Insig... » read more

Manufacturing Bits: July 3


MacEtch and chips Singapore’s Agency for Science, Technology and Research (A*STAR) has advanced a technology called metal-assisted chemical etching or MacEtch for use in the fabrication of silicon nanowires and related structures. Silicon nanowires are used in several applications, such as electronics, solar, storage, optical, catalysis, drug delivery and sensors. In semiconductors, the ... » read more

The Week In Review: Manufacturing


German laser giant Trumpf is spending more than 70 million euros ($76.9 million) to build a new facility for its laser amplifier technology in EUV lithography applications. Trumpf has nothing to do with the Republican presidential candidate Donald Trump. But rather Trumpf is a German-based supplier of machine tools, lasers and electronics for industrial applications. Meanwhile, Trumpf’s new b... » read more

The Week In Review: Manufacturing


After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

Bluetooth Smart Becomes Centerpiece Of Internet Of Things


There was a consistent theme at the CEATEC 2013, which was held in Makuhari, Chiba Prefecture—Bluteooth Smart as an essential component of the Internet of Things. Photo 1 CEATEC hall Major parts makers such as Rohm and Murata, Mitsumi, and Alps, which are developing entire modules as well as discrete parts, proposed a number of solutions that will be used over the next two or three ... » read more