Inspection, Metrology Challenges Grow For SiC


Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

SiC Demand Growing Faster Than Supply


The silicon carbide (SiC) industry is in the midst of a major expansion campaign, but suppliers are struggling to meet potential demand for SiC power devices and wafers in the market. In just one example of the expansion efforts, Cree plans to invest up to $1 billion to increase its SiC fab and wafer capacities. As part of the plan, Cree is developing the world’s first 200mm (8-inch) SiC f... » read more

Week In Review: Manufacturing, Test


Fab tools and test Lam Research has developed a new self-maintaining or self-cleaning chamber for its etch tools. With the technology, Lam announced a new industry benchmark has been set for productivity in etch processing using its self-maintaining equipment. Etch process modules are typically cleaned weekly or monthly. Recently, Lam and a chipmaker reached the milestone of going 365 days... » read more

Electric Cars Gain Traction, But Challenges Remain


Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market. Limited driving range, high costs, battery issues, and a spotty charging infrastructure are the main challenges for battery electric vehicles (BEVs). In addition, there are issues with various power semic... » read more

SiC Chip Demand Surges


The silicon carbide (SiC) power semiconductor market is experiencing a sudden surge in demand amid growth for electric vehicles and other systems. But the demand also is causing a tight supply of SiC-based devices in the market, prompting some vendors to add fab capacity in the midst of a tricky wafer-size transition. Some SiC device makers are transitioning from 4- to 6-inch wafers in the f... » read more

The Week In Review: Design


Tools Mentor released the latest version of its FloTHERM CFD software for electronics cooling simulation, adding a new design window to create and solve variants of a model with features to improve scenario definition and design space exploration. Other enhancements include support for Phase Change Materials, more abilities for PCB designs, and an improved parallel solver. Markets IC Insig... » read more

Manufacturing Bits: July 3


MacEtch and chips Singapore’s Agency for Science, Technology and Research (A*STAR) has advanced a technology called metal-assisted chemical etching or MacEtch for use in the fabrication of silicon nanowires and related structures. Silicon nanowires are used in several applications, such as electronics, solar, storage, optical, catalysis, drug delivery and sensors. In semiconductors, the ... » read more

The Week In Review: Manufacturing


German laser giant Trumpf is spending more than 70 million euros ($76.9 million) to build a new facility for its laser amplifier technology in EUV lithography applications. Trumpf has nothing to do with the Republican presidential candidate Donald Trump. But rather Trumpf is a German-based supplier of machine tools, lasers and electronics for industrial applications. Meanwhile, Trumpf’s new b... » read more

The Week In Review: Manufacturing


After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

Bluetooth Smart Becomes Centerpiece Of Internet Of Things


There was a consistent theme at the CEATEC 2013, which was held in Makuhari, Chiba Prefecture—Bluteooth Smart as an essential component of the Internet of Things. Photo 1 CEATEC hall Major parts makers such as Rohm and Murata, Mitsumi, and Alps, which are developing entire modules as well as discrete parts, proposed a number of solutions that will be used over the next two or three ... » read more