Chip Industry Week in Review


Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making it more energy-efficient. Specifically, the goal is to replace today's CO2-based laser with a solid-state laser, using a thulium-doped yttrium lithium fluoride medium to increase the laser's powe... » read more

Increasing Roles For Robotics In Fabs


Different types of robots with greater precision and mobility are beginning to be deployed in semiconductor manufacturing, where they are proving both reliable and cost-efficient. Static robots have been used for years inside of fabs, but they now are being supplemented by collaborative robots (cobots), autonomous mobile robots (AMRs), and autonomous humanoid robots to meet growing and widen... » read more

U.S. Fab Investments Rise


Thin Film Electronics is opening a chip fabrication facility in San Jose, Calif., that will produce devices on rolls of flexible materials, using technology similar to inkjet printing, rather than the standard semiconductor production equipment geared toward silicon wafers. At the same time, Samsung Electronics and GlobalFoundries are expanding their wafer fabrication plants in Austin, Texas... » read more