The Week in Review: IoT

By Jeff Dorsch - 05 Aug, 2016 - Comments: 0

Deals Rambus finalized its acquisition of the memory interconnect business at Inphi. The closing price was $90 million in cash. The former Inphi business became part of the Memory and Interfaces Division at Rambus. CyberX raised $9 million of private funding in a financing round led by Flint Capital. Glilot Capital Partners, Swarth Group, and GlenRock, all existing investors, were joined by... » read more

The Week In Review: Design/IoT

By Jesse Allen - 31 Jul, 2015 - Comments: 0

M&A ARM acquired Israel-based Sansa Security, a provider of hardware security IP and software for advanced system-on-chip components deployed in IoT and mobile devices. The company's technology is currently deployed across a range of smart connected devices and enterprise systems. Sansa IP will be integrated into ARM's TrustZone and IoT portfolios. Standards Accellera sent UVM 1.2 ... » read more

Biometrics For The IoT

By Ernest Worthman - 04 Jun, 2015 - Comments: 0

In part one of this topic we started at the top with an overview of biometrics and its base technology. Now, let’s ratchet that up a notch and drill down a bit into some of the details. While biometrics has a lot of potential tools, presently there are only two that are in wide-scale deployment—fingerprint and facial scanning. “Of those two, fingerprints account for 60% to 70% of all a... » read more

Is The IoT Safe To Use?

By Ernest Worthman - 11 May, 2015 - Comments: 0

By Ernest Worthman & Ed Sperling Data security has been a problem since well before the invention the computer, and it has been getting progressively more difficult to contain every year for the past eight decades. It was made much worse when computing was decentralized with the introduction of the IBM PC in 1981, made worse again when networking was introduced into corporations by Novell'... » read more

The Next Generation Of Wearables

By Ernest Worthman - 07 May, 2015 - Comments: 0

As the wearable market begins to take root, so has the focus on ultra-low power design—with some unique headaches that are unique to wearables. To begin with, there is much attention being paid to this market because of the almost staggering predictions associated with it. While numbers vary greatly, IDC predicts as many as 126 million units will be shipping annually by 2019. The five-year... » read more

Get Ready For More Biometrics

By Ernest Worthman - 07 May, 2015 - Comments: 0

Security involving scans of fingerprints, palms, faces, or some other variant has been common in movies for years, and many phones and computers now offer fingerprint scans instead of a password login. But as security risks rise with the rollout of the [getkc id="76" comment="Internet of Things"]/Internet of Everything, that technology will need to become much more pervasive and sophisticated. ... » read more

Challenges For IC Security

By Ernest Worthman - 05 Feb, 2015 - Comments: 0

Keeping chips secure is really a foot race between the good guys and the bad guys. Going forward, expect heavily funded, grouped efforts to place tremendous pressure on security envelopes. This includes everything from simple home devices, such as routers, to the most critical infrastructures, such as power, telecom, transportation, and soon, the IoT. Fig. 1: Courtesy of Blade Genexis I... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer