Startup Funding: August 2020

By Jesse Allen - 02 Sep, 2020 - Comments: 0

Semiconductor startups were hot this month, with big funding going to designers and chip analytics. In automotive, one Chinese electric vehicle company raised another large round right before its IPO, and a LiDar maker's reverse merger gave it a cash infusion and set it on its own IPO road. Plus, a growing quantum computer developer saw a funding boost. This month, we feature 17 startups that c... » read more

The Week in Review: IoT

By Jeff Dorsch - 06 Oct, 2017 - Comments: 0

Finance Mountain View, Calif.-based FogHorn Systems has received Series B funding of $30 million, led by Intel Capital and Saudi Aramco Energy Ventures. The new round brings the Industrial Internet of Things edge computing startup’s total funding to $47.5 million. Honeywell Ventures is a new investor, joining existing investors Darling Ventures, Dell Technologies Capital, GE Ventures, March ... » read more

The Week In Review: Design

By Jesse Allen - 21 Jul, 2017 - Comments: 0

Tools Mentor released the latest version of its FloTHERM CFD software for electronics cooling simulation, adding a new design window to create and solve variants of a model with features to improve scenario definition and design space exploration. Other enhancements include support for Phase Change Materials, more abilities for PCB designs, and an improved parallel solver. Markets IC Insig... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Saudi Aramco

Startup Funding: August 2020

The Week in Review: IoT

The Week In Review: Design