Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Startup Funding: February 2022

By Jesse Allen - 07 Mar, 2022 - Comments: 0

Mega-rounds dominated venture funding in February, with ten companies seeing investment of $100 million or more, five of which exceeded $200 million. Automotive was the big winner, with seven of the ten companies involved in either developing ADAS and autonomous driving, building electric vehicles, or making components to go in cars. The largest round of the month falls into that last category,... » read more

Startup Funding: May 2021

By Jesse Allen - 02 Jun, 2021 - Comments: 0

Big investment poured into AI hardware companies this month, with a focus on edge applications. Companies are experimenting with different architectures, including analog-focused devices and those that are capable of withstanding the harsh conditions of space. IP and EDA startups in China also drew funding as the country tries to create a full chip design ecosystem. Plus, PCB assembly, photonic... » read more

Startup Funding: December 2020

By Jesse Allen - 06 Jan, 2021 - Comments: 1

AI hardware startups were hot in our December startup-funding focus, with two companies landing rounds exceeding $100M and plenty of others seeing investment. Two Chinese EDA companies received funding in a bid to boost the country's semiconductor ecosystem. One company providing control systems for fabs achieved $8M in Series A, and both autonomous driving and electric vehicles pulled in lots ... » read more

December ’18 Startup Funding: Big Rounds As 2018 Ends

By Jeff Dorsch - 03 Jan, 2019 - Comments: 0

During the month of December, 16 startups had private funding rounds of $100 million and up, with half of them in the mobility area. Those 16 rounds totaled $3.2 billion as the year concluded. Before the holidays, the SoftBank Vision Fund invested $500 million in Cambridge Mobile Telematics, provider of the DriveWell platform used by insurers, vehicle fleets, wireless carriers, and others to... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer