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Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Week In Review

By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Week In Review: Automotive, Security, Pervasive Computing

By Liz Allan - 23 Jun, 2023 - Comments: 0

Stellantis and Foxconn formed a 50/50 joint venture called SiliconAuto, to be headquartered in the Netherlands. The goal is to close the gap between supply and demand for chips used in computer-controlled features and modules, especially for electric vehicles (EVs). The U.S. Department of Justice created a National Security Cyber Section within its National Security Division to increase the ... » read more

Trending Articles

Chip Industry Week In Review

ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new security IP and algorithms; neuromorphic AI chip; adaptive MCUs; auto superbrains.

by The SE Staff

Chip Industry Week In Review

Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.

by The SE Staff

What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Chiplets Add New Power Issues

Well-understood challenges become much more complicated when SoCs are disaggregated.

by Ann Mutschler

3D-IC For The Masses

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?

by Brian Bailey

Knowledge Centers
Entities, people and technologies explored

Related Articles

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs

A new lithography library brings mask optimization operations to GPUs.

by Thuc Dam

Global IC Fabs And Facilities Report: 2024

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.

by Liz Allan

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

by Gregory Haley

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Auto Chip Aging Accelerates In Hot Climates

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.

by Ed Sperling

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.

by Bryon Moyer

Baby Steps Toward 3D DRAM

Stacking layers means a complete architecture rethink.

by Bryon Moyer

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