The Week In Review: IoT

By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

The Next Level Of Chip Security

By Ernest Worthman - 09 Dec, 2014 - Comments: 0

As we move to that magic year, 2020, which is commonly being recognized as the year when the IoT is supposed to be in full bloom, the security issues just keep coming. The rate of cyber exploits continue to ramp up daily. Yet there seems to be just as much complacency about the [getkc id="76" comment="Internet of Things"] as there is about the Internet of today. It seems we are becoming desensi... » read more

We Are All Vulnerable

By Brian Bailey - 27 Mar, 2014 - Comments: 1

Target, Neiman Marcus, Michaels. We are all familiar with the huge loss of personal and financial data from these establishments. A lot more people are fuming over the data being accessed by the NSA. While we only know the details as leaked by Edward Snowden, this has to be the biggest data breach in history with the government having hacked into the data centers of Google, Yahoo and who knows ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: security breaches

The Week In Review: IoT

The Next Level Of Chip Security

We Are All Vulnerable