Chip Industry Week In Review


Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Chip Industry Week In Review


ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Week In Review


Global chips sales hit a record $56.9 billion in October, a 22% increase versus October 2023, according to the Semiconductor Industry Association. Also, global semiconductor equipment billings reached $30.38 billion in Q3 2024, a 19% YoY increase and 13% growth QoQ, SEMI reported. TSMC commenced equipment installation for its 2nm fab in Kaohsiung, Taiwan, six months ahead of schedule. The 2n... » read more

EMEA Investments Driving Technology Specialization


Government programs across Europe and the UK are seeing a surge of investments in leading edge technology, materials, and packaging. Industry and academia are coalescing around specialty areas, drawing on established relationships to foster innovation and fill gaps in regional supply chains while also maintaining international bonds. Government initiatives also are picking up in Israel, Saudi A... » read more

Chip Industry Week In Review


Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more