Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 16 Dec, 2022 - Comments: 0

Automotive, mobility Automaker Toyota and Texas-based electricity distributor Oncor Electric Delivery (Oncor) are embarking on a vehicle-to-grid (V2G) pilot project to explore the feasibility of transferring energy from BEVs’ batteries back to the grid. Toyota and Oncor want to better understand the interconnectivity between BEVs and utilities. The project will start testing at Oncor’s res... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 15 Jul, 2022 - Comments: 0

Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 04 Feb, 2022 - Comments: 0

Pervasive computing, IoT and 5G The U.S. company SpaceX deployed more satellites into LEO (low earth orbit) Starlink constellation and launched a premium service for businesses that costs $500 a month, bringing download speeds of 150-500 Mbps and latency of 20-40ms. The regular Starlink service is $99 a month. Starlink has launched over 2,000 satellites into its constellation, according to sta... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SEMI Taiwan

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing