A view from the top (20)

By Chris Mack - 08 Nov, 2011 - Comments: 0

It is an article of faith among semiconductor industry watchers that the last 20 years have seen considerable consolidation among semiconductor makers, with further consolidation all but inevitable. Of course, we can all point to mergers (TI and National being the latest) and players exiting from the market (NEC was the #1 chipmaker in the world in 1991, but now is out of the business). But d... » read more

The top 20 ain’t what it used to be

By Chris Mack - 27 Oct, 2011 - Comments: 0

Looking back on data of the annual top 20 semiconductor companies since 1987, it’s amazing how much has changed. In my last post I looked at all the companies that went bankrupt, spun-out, or merged their way into or out of the top 20 list. Change is definitely a constant in this field. Now, let’s look at the makeup of the 2010 list of top semiconductor companies. Here is the list, as g... » read more

It’s hard to stay on top

By Chris Mack - 13 Oct, 2011 - Comments: 0

As part of my fascination with the history of the semiconductor industry, I’ve recently been reviewing data on the annual top 20 semiconductor companies since 1987. Using revenue data compiled by Gartner Dataquest (through 1999) and iSupply (2000 – 2010), it’s been very interesting to see what changes have come about at the top of the heap in our industry. Here is a brief synopsis of so... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Semiconductor top 20

A view from the top (20)

The top 20 ain’t what it used to be

It’s hard to stay on top

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Startup Funding: Q3 2024

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers
Entities, people and technologies explored