Week in Review: IoT, Security, Auto

By Jeff Dorsch - 17 May, 2019 - Comments: 0

Internet of Things Verizon Communications launched its nationwide narrowband Internet of Things network, saying it covers more than 92% of the U.S. population. “There is a whole universe of smart solutions needing scalable and affordable connections,” Jeffrey Dietel, senior vice president of business marketing and products, said in a statement. “By launching our NB-IoT network, Verizon i... » read more

IoT Security Risks Grow

By Ed Sperling - 09 Jan, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in ARM's Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at GlobalFoundries; Chowdary Yanamadala, senior vice president of business development at ChaoLogix; and Eric Sivertson, CEO of Quantum Trace. What follows ar... » read more

IoT Security Risks Grow

By Ed Sperling - 05 Dec, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in [getentity id="22186" comment="ARM"]'s Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at GlobalFoundries; Chowdary Yanamadala, senior vice president of business development at [getentity id="22819" comment="Glob... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week in Review: IoT, Security, Auto

IoT Security Risks Grow

IoT Security Risks Grow