Making Buildings Smarter

By Jeff Dorsch - 04 Oct, 2018 - Comments: 1

Calling a building “smart” implies that technology is embedded to make that building more efficient, useful, convenient and profitable. The goal is to program efficiency beyond what humans can provide. But “smart” also may imply a healthy dose of marketing hype. No one wants to live in a “dumb building,” but it's difficult to define what makes a building smart. And while much is ... » read more

The Week in Review: IoT

By Jeff Dorsch - 25 May, 2018 - Comments: 0

Finance Orbbec of Shenzhen, China, a developer of motion sensing technology, raised more than $200 million in Series D funding led by Ant Financial. Also participating in the new round were SAIF Financial, Green Pine Capital Partners, R-Z Capital, and Tianlangxing Capital Partners. Established in 2013, Orbbec develops 3D sensors for applications in facial recognition, gesture recognition, robo... » read more

Intelligent Buildings

By Arm - 05 Jan, 2017 - Comments: 0

ARM believes that by 2035 one trillion devices will be connected to the internet. We will find a large number of them in the next generation of high performing buildings. According to McKinseyi, half the opportunities for Internet of Things (IoT) vendors are expected to come from the built environment; from homes, buildings, factories and cities. More than 50 percent of the world’s seven b... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: smart buildings

Making Buildings Smarter

The Week in Review: IoT

Intelligent Buildings