System Bits: May 28

By Jeff Dorsch - 28 May, 2019 - Comments: 0

Home robotics get cozier Cornell University’s Guy Hoffman was perplexed when he first saw social robots in stores. “I noticed a lot of them had a very similar kind of feature – white and plasticky, designed like consumer electronic devices,” said Hoffman, assistant professor and the Mills Family Faculty Fellow in the Sibley School of Mechanical and Aerospace Engineering. “Especial... » read more

Pace Quickens As Machine Learning Moves To The Edge

By Brian Fuller - 09 Aug, 2018 - Comments: 0

Artificial intelligence applications are rapidly changing the way society engages with technology. It wasn’t too long ago that your smart phone couldn’t recognize your face or your thumbprint. It also wasn’t too long ago that Alexa wasn’t helping you navigate your day so easily. And not too long ago, odds are, you weren’t developing an application or device that had AI/ML as its ce... » read more

Robots Get Social

By Elizabeth Pavel - 18 Jan, 2018 - Comments: 0

From Star Trek’s Data to Star Wars’ C-3PO, the idea of humanoid robots has fascinated people for years. Back in the real world, robots build automobiles in factories, mow lawns, and even assist in complex heart surgery. Meanwhile, the use of androids like Data is approaching reality, as semiconductor and semiconductor-related devices like low-power microprocessors, 3D sensors, accelerometer... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

System Bits: May 28

Pace Quickens As Machine Learning Moves To The Edge