tag: soft IP

Time For FMEDA Reuse?
By Stefano Lorenzini - 07 Jul, 2022 - Comments: 0

How do designers quantify safety in electronic systems? Through one or more tables called Failure Modes, Effects and Diagnostic Analysis – FMEDA. In fact, an FMEDA does not have to be a table; it could be manifested in scripts or some other form, but a table is the easiest way to think of this information. Think of an FMEDA for an IP, as the concept extends easily to a system-on-chip (SoC). T... » read more

Power Management And Integration Of IPs In SoCs: Part 1
By Progyna Khondkar - 09 Apr, 2020 - Comments: 0

IPs – whether in the form of soft or hard macros – are the epicenter of today’s SoC designs. Integration of IP with low power designs and conducting power aware (PA) verification are always complex and cumbersome. Because most of these IPs are self-contained, pre-verified at the block level, and must be preserved in their totality when integrated or verified at the SoC level. Until UPF... » read more

How To Build An Automotive Chip
By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

IP Requirements Changing
By Brian Bailey - 25 Feb, 2016 - Comments: 0

Twenty years ago the electronics industry became interested in the notion of formalizing re-use through third-party IP. It has turned out to be harder than anyone imagined. In 1996, the Virtual Socket Interface Alliance ([getentity id="22845" comment="VSIA"]) was formed to standardize the development, distribution and licensing of IP. Soon afterward, companies with a couple of people in a ga... » read more

IP Integration Challenges Rising
By Ann Mutschler - 24 Jul, 2014 - Comments: 0

It’s not just [getkc id="80" comment="lithography"] that is putting a crimp in sub-28nm designs. As more functions, features, transistors and software are added onto chips, the pressure to get chips out the door has forced chipmakers to lean more heavily on third-party IP providers. Results, as you might expect, have been mixed. The number of blocks has mushroomed, creating its own web of ... » read more

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