tag: Sony

Bulk CMOS Vs. FD-SOI
By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Apr, 2016 - Comments: 0

Chipmakers As reported, Samsung is expanding its efforts in the foundry business, a move that will put the company on a collision course with TSMC and others. Samsung's foundry unit is expanding is logic portfolio and moving into the specialty foundry front. It will also make its advanced packaging technology available, such as 2.5D interposers, to customers. In a blog, Samsung said it plans t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

What’s Next In Mobile Displays
By Mark LaPedus - 17 Dec, 2015 - Comments: 0

The next wave of smartphones and wearables is invading the market. These systems will feature a new class of high-resolution displays, and in the near future displays will become foldable and rollable, although there are still some challenges with this technology. To be sure, mobile display technology is advancing on several fronts. On one front, for example, Apple and other systems vendor... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Oct, 2015 - Comments: 0

Is the sky falling in the IC equipment market? Not yet, but watch out below. Semi capital spending is expected to reach $60.37 billion in 2015, down 1% from 2014, according to Pacific Crest Securities. “Although we trimmed 2016 capex three weeks ago, we are trimming some more. We now see semiconductor capex down 4% in 2016. However, we do not see capex falling off a cliff in 2016 (i.e., down ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Sep, 2015 - Comments: 0

In case you missed it, Apple rolled out its latest iPhones and other products. The latest iPhone 6 is using chips based on finFETs. So, who won Apple’s application processor foundry business for the iPhone 7? “In our foundry checks, it appears Apple is likely splitting the 14/16nm business for the recent product launches between TSMC and Samsung. We suspect Samsung’s 14nm is used for the ... » read more

Capex Growing To A Record High In 2015
By Adrienne Downey - 18 Jun, 2015 - Comments: 0

Semiconductor companies are spending more than ever to stay competitive. In 2015, the total amount spent for capital expenditures is forecast to be $68.7 billion, up 9% from 2014’s $63.3 billion. This breaks the previous record set in 2011 at $63.8 billion, as shown in the following graph. Total Semiconductor Capital Expenditures, 2009-2015 Source: Semico Research Corp. The Top 15 A... » read more

Japan: Finding Leadership In New Technology Areas
By SEMI - 18 Jun, 2015 - Comments: 0

By Osamu Nakamura The semiconductor industry is a technology-driven industry — and technology invention and innovation are the engines that drive industry growth. Japan has seen the global landscape for semiconductor manufacturing change, and in turn, Japan’s semiconductor industry has been changing, finding technology leadership opportunities in emerging technology areas that lead to grow... » read more

Trouble Ahead For IP industry?
By Brian Bailey - 14 May, 2015 - Comments: 0

[getkc id="106" kc_name="Power-aware design"] has risen from an afterthought to a primary design constraint for some design types. Initially it was smart phones and other battery operated devices. It has consistently expanded into additional areas including those plugged into the wall and those plugged into the grid. Some parts of the world are imposing restrictions on the power that a device c... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Feb, 2015 - Comments: 0

IBM continues to cut jobs, according to IEEE Spectrum and an IBM employee organization. Meanwhile, IBM and SUNY Polytechnic Institute announced that more than 220 engineers and scientists who lead IBM's advanced chip R&D efforts at SUNY Poly's Albany Nanotech campus will become part of IBM Research. While military applications continue to experience strong growth in RF gallium-nitride (GaN)... » read more

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