Glitched On Earth By Humans

By Jasper van Woudenberg - 03 Nov, 2022 - Comments: 0

The Black Hat conference always brings up interesting and current research within the device security industry. Lennert Wouters of COSIC studied the security of the Starlink User Terminal. After some PCB-level reverse engineering, he found a serial port and observed various boot loaders, U-boot, and Linux running on the device. However, there was no obvious way to gain further access. The... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 04 Feb, 2022 - Comments: 0

Pervasive computing, IoT and 5G The U.S. company SpaceX deployed more satellites into LEO (low earth orbit) Starlink constellation and launched a premium service for businesses that costs $500 a month, bringing download speeds of 150-500 Mbps and latency of 20-40ms. The regular Starlink service is $99 a month. Starlink has launched over 2,000 satellites into its constellation, according to sta... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 May, 2019 - Comments: 0

Internet of Things Paris-based Parrot Drones and five other companies were selected by the Pentagon’s Defense Innovation Unit and the U.S. Army to adapt off-the-shelf commercial drones for combat applications as part of the Army’s Short Range Reconnaissance program. SRR seeks to develop unmanned aerial vehicles that have a flight time of 30 minutes, a range of three kilometers (nearly two ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Starlink

Glitched On Earth By Humans

Week In Review: Auto, Security, Pervasive Computing

Week in Review: IoT, Security, Auto