Using Machine Learning For Characterizations Of NoC Components

By Arteris - 06 Oct, 2021 - Comments: 0

Modern NoC (Network-on-Chip) is built of complex functional blocks, such as packet switches and protocol converters. PPA (performance/power/area) estimates for these components are highly desirable during early design phases – long before NoC gate level netlist is synthesized. At this stage a NoC component is a soft module, described by a set of architectural parameters, like the bit width of... » read more

Using Synopsys Z01X To Accelerate The Fault Injection Campaign Of A Fully Configurable IP

By Arteris - 05 Jun, 2019 - Comments: 0

By Arteris IP Alexis Boutillier, Corporate Application Manager, Safety Manager, and Mohan Krishnareddy, Solution Engineer, at the Synopsys Users Group (SNUG), March 2018, Santa Clara, CA. Principles and real-world practices of ISO 26262 for semiconductor design teams. After providing an overview of how functional safety affects management, development, and supporting processes, the paper exp... » read more

Power Optimization Strategies Widen

By Brian Bailey - 10 May, 2018 - Comments: 0

An increasing amount of electronic content in new and existing markets is creating different and sometimes competing demands for power optimization. For the past decade, EDA has been driven by the mobile phone industry, where the emphasis is on better power analysis and optimization tools to reduce power consumption and extend battery life. While energy efficiency continues to improve, other... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Synopsys User Group

Using Machine Learning For Characterizations Of NoC Components

Using Synopsys Z01X To Accelerate The Fault Injection Campaign Of A Fully Configurable IP

Power Optimization Strategies Widen