tag: TCS

Chip Industry Week in Review

By The SE Staff - 27 Jun, 2025 - Comments: 0

AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

The Week In Review: IoT

By Jeff Dorsch - 25 Nov, 2016 - Comments: 0

Analysis The Internet of Things may be entering the infamous “Trough of Disillusionment” in the Gartner Hype Cycle, according to some observers. “There’s a general malaise growing around IoT. Where is this shiny, artificially intelligent, fully connected future of things we were promised?” iobeam CEO Ajay Kulkarni writes in this analysis. Others are more sanguine about the IoT. Clear... » read more

Trending Articles

Chip Industry Week in Review

EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.

by The SE Staff

Chip Industry Week in Review

IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromorphic compute system; GAA forksheets; AMD's new GPUs.

by The SE Staff

RISC-V’s Increasing Influence

Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.

by Brian Bailey

Co-Packaged Optics Reaches Power Efficiency Tipping Point

But blazing fast data speeds come with significant manufacturing challenges.

by Laura Peters

Chip Industry Week in Review

Qualcomm to buy Alphawave; reworking chip grants; global semi, equipment sales up; GF's $16B expansion; Arm's AI-defined vehicles platform; Mexico's push; DRAM/DDR4; AI-powered RF design; MLPerf results; rare earths/magnets slow automakers; BEOL thermal resistance in BPD and chiplets.

by The SE Staff

Knowledge Centers
Entities, people and technologies explored

Related Articles

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

by Jesse Allen

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

by Bryon Moyer

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Chip Industry Week in Review

EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.

by The SE Staff

Chip Industry Week in Review

IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromorphic compute system; GAA forksheets; AMD's new GPUs.

by The SE Staff

RISC-V’s Increasing Influence

Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.

by Brian Bailey

What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

by Bryon Moyer

Big Changes Ahead For Interposers And Substrates

New materials and processes will help with power distribution and thermal dissipation in advanced packages.

by Gregory Haley

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2025 SMG | Terms of Service | Privacy Policy