tag: Teledyne Lecroy

Chip Industry Week In Review
By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Aug, 2018 - Comments: 0

Achronix and Mentor uncorked an optimized HLS flow for Achronix's FPGA technology products. The integrated development environment enables designers to quickly go from C++ to FPGA using Mentor's Catapult HLS and Achronix's ACE design tools. Initially used for 5G wireless applications to reduce the overall development effort and improve QoR, it is suitable for any design targeting Achronix techn... » read more

The Week In Review: IoT
By Jeff Dorsch - 28 Jul, 2017 - Comments: 0

Finance August Home received $25 million in Series C funding, bringing its total funding to $75 million. Existing investors Bessemer Venture Partners, Comcast Ventures, Maveron, and Qualcomm Ventures were joined by AGL, Liberty Mutual, and SPDG. The Internet of Things startup will use the money to expand operations and to extend its offerings in home access products and services. Prospera, ... » read more

Oscilloscopes: The EE’s Stethoscope
By Gale Morrison - 17 Nov, 2016 - Comments: 0

Oscilloscopes are like the electricity to your house. You don't give it much thought until a storm knocks it out. The entire electronics industry can't function without oscilloscopes. But this equipment is such a constant and so consistent, we sometimes forget it's there. Semiconductor Engineering spent time with three Test & Measurement (T&M) industry stalwarts to talk about Oscillo... » read more

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