Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Jun, 2019 - Comments: 0

Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 13 Jul, 2018 - Comments: 0

Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

The Week in Review: IoT

By Jeff Dorsch - 13 Apr, 2018 - Comments: 0

Finance Palo Alto, Calif.-based Armis raised $30 million in Series B funding, bringing total funding for the provider of enterprise Internet of Things security to $47 million. Red Dot Capital Partners of Israel led the round, joined by Bain Capital Ventures. Existing investors Sequoia Capital and Tenaya Capital also participated in the latest funding, which Armis will use to expand sales and m... » read more

Knowledge Centers
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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Telit Communications

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week in Review: IoT

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