Week in Review: IoT, Security, Auto

By Jeff Dorsch - 04 Jan, 2019 - Comments: 0

Internet of Things The drone episode last month at Gatwick Airport in the United Kingdom forced the cancellation or diversion of more than 1,000 flights over three days. While local police arrested a couple suspected of being behind the drone flights, they were quickly exonerated and released. Questions remain on how airports should respond to such episodes, which are bound to happen again and... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 09 Nov, 2018 - Comments: 0

Internet of Things What’s better than a 5G network? How about a local, private 5G network? The Industrial Internet of Things may drive the development of such networks. Of course, 5G cellular communications technology is still being worked out worldwide. BMW, Daimler, and Volkswagen are looking ahead to the future; those automotive manufacturers notified Germany’s Federal Network Agency th... » read more

The Week in Review: IoT

By Jeff Dorsch - 27 Oct, 2017 - Comments: 0

Finance Automile, an Internet of Things company involved in field-service businesses, has received $34 million in Series B funding led by Insight Venture Partners, bringing its total funding to $47 million. Existing investors Dawn Capital, Point Nine Capital, SaaStr Fund, and Salesforce Ventures also participated in the new round. Automile will use the money on marketing, product developmen... » read more

The Week In Review: IoT

By Jeff Dorsch - 03 Mar, 2017 - Comments: 0

Conferences The number of IoT and IoT-related conferences continues to grow, but IoT also is beginning to make inroads into established conferences. The Mobile World Congress, held this week in Barcelona, Spain, teemed with Internet of Things announcements from many companies. SEMICON Southeast Asia, scheduled for April 25-27 at SPICE in Penang, Malaysia, will feature the World of IoT: Futur... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Telstra

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week in Review: IoT

The Week In Review: IoT

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