Mobile World Congress; embedded world 2017; Jasper likes NB-IoT.
Conferences
The number of IoT and IoT-related conferences continues to grow, but IoT also is beginning to make inroads into established conferences. The Mobile World Congress, held this week in Barcelona, Spain, teemed with Internet of Things announcements from many companies. SEMICON Southeast Asia, scheduled for April 25-27 at SPICE in Penang, Malaysia, will feature the World of IoT: Futura-X showcase, demonstrating cutting-edge applications and innovations in electronics and other areas. And closer on the calendar is the embedded world 2017 exhibition and conference, set for March 14-16 in Nuremberg, Germany.
Products
Altair Semiconductor said its ALT1160 CAT-1 LTE for IoT chipset has been certified to run over T-Mobile’s 4G LTE network.
Altair, Landis + Gyr, and Sierra Wireless reported that Telstra is working with their IoT products on its network in Australia.
Rohde & Schwarz worked with Qualcomm Technologies to test and verify Qualcomm’s MDM9206 global Cat M1/Cat NB-1 dual-mode LTE modem for narrowband IoT networks.
Jasper, a unit of Cisco Systems, now supports NB-IoT with its Control Center platform.
The TOBY-R202 and TOBY-R200 LTE Cat 1 modules from u-blox are certified for T-Mobile’s 4G LTE network.
Deals
AT&T is working with China Mobile on IoT products and services.
Market Research
Research and Markets forecasts the IoT managed services market will increase from $21.85 billion last year to $79.6 billion by 2021, for a compound annual growth rate of 29.5%. Its report is available here.
Steps are being taken to minimize problems, but they will take years to implement.
But that doesn’t mean it’s going to be mainstream anytime soon.
Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking.
New capacity planned for 2024, but production will depend on equipment availability.
Number of options is growing, but so is the list of tradeoffs.
Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Steps are being taken to minimize problems, but they will take years to implement.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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