Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

Startup Funding: April 2021


April showers brought mega fundraising rounds to the semiconductor industry. In China, a mobile chipset maker looking to go public won significant funding along with partnerships with major smartphone companies. In the US, AI hardware startups are drawing interest with unique processor architectures and business models. Plus, a major test and design services company drew new investment. This mo... » read more

Week In Review: Design, Low Power


Ansys will acquire Lumerical, a developer of photonic design and simulation tools. "The potential of photonics in applications like 5G, IIoT and autonomous vehicles can only be realized by solving immense multiphysics device and system challenges," said James Pond, co-CEO and CTO of Lumerical. "Together, Lumerical and Ansys are uniquely positioned to provide the necessary solutions, and custome... » read more

Week In Review: Manufacturing, Test


Market research IC Insights has released its forecast for chips in terms of applications. Communications is still the biggest IC market, but automotive is growing the fastest. In its first forecast of artificial intelligence (AI) edge processors, International Data Corp. (IDC) estimates that worldwide shipments of AI-optimized processors for edge systems will reach 340.1 million units in 20... » read more

The Week In Review: Manufacturing


Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more