The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing


The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass substrates, the peak of the mountain is in sight. The arrival of glass substrates comes at an opportune time, as the industry eyes new process innovations to meet the incredible demand for high perfo... » read more

Research Bits: Aug. 30


Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more