Chip Industry Week In Review

By The SE Staff - 17 Jan, 2025 - Comments: 0

GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

by Gregory Haley

Auto Chip Aging Accelerates In Hot Climates

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.

by Ed Sperling

GDDR7 Memory Supercharges AI Inference

High bandwidth and low latency are paramount for AI-powered edge and endpoints.

by Tim Messegee

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.

by Bryon Moyer

Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

by Laura Peters

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Chip Industry Week In Review

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