May’19 Startup Funding: Mega-Funding Rounds Continue

By Jeff Dorsch - 05 Jun, 2019 - Comments: 0

In May, 20 startups enjoyed the distinction of getting a mega-round of $100 million or more in private funding. Those 20 companies together took in more than $6.65 billion. There were two billion-dollar investments in recent weeks. GM Cruise, the autonomous vehicle startup, received $1.15 billion in new funding from General Motors, Honda Motor, the SoftBank Vision Fund, T. Rowe Price Asso... » read more

Investors Back IoT Startups

By Jeff Dorsch - 07 Mar, 2018 - Comments: 0

Internet of Things startups took in more than $1.35 billion from corporate and private investors during the latter half of 2017, for a total of about $2.2 billion in the full year. Chicago-based Uptake Technologies, an Industrial IoT startup, had the biggest haul of the year, with $117 million raised in a Series D round, on top of a $90 million Series C round earlier in 2017, bringing its to... » read more

The Week in Review: IoT

By Jeff Dorsch - 19 Jan, 2018 - Comments: 0

Finance VDOO Connected Trust received $13 million in seed funding led by 83North, with participation by Dell Technology Capital and individual investors David Strohm, Joe Tucci, and Victor Tsao. The startup offers Internet of Things device developers the capability to add cybersecurity features to those devices after they’re deployed. VDOO was founded last year in Israel by Netanel Davidi, U... » read more

The Week In Review: IoT

By Jeff Dorsch - 19 May, 2017 - Comments: 0

Conferences It’s been an action-packed week at Internet of Things World. The show was co-located at the Santa Clara Convention Center with the Connected & Autonomous Vehicles conference. There were lots of deals announced and many products or services debuted at IoT World, which has grown enormously in four years, from 700 attendees at its first event in Palo Alto, Calif., in 2014 to some 14... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: The Rise Fund

May’19 Startup Funding: Mega-Funding Rounds Continue

Investors Back IoT Startups

The Week in Review: IoT

The Week In Review: IoT