Framework for Optimizing Reliability and Thermal Management of 3DICs (National Taiwan Univ., Lamar Univ.)


A new technical paper titled "The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits" was published by researchers at National Taiwan University and Lamar University. Abstract "The use of vertically stacked architectures in three-dimensional integrated circuits (3DICs) offers a transformative path for advancing Moore’s Law by significantly boosting co... » read more

New Method For Determining How 2D Materials Expand (MIT)


A new technical paper titled "A unified approach and descriptor for the thermal expansion of two-dimensional transition metal dichalcogenide monolayers" was published by researchers at MIT and Southern University of Science and Technology (China). "A new technique that accurately measures how atom-thin materials expand when heated could help engineers develop faster, more powerful electronic... » read more