Thermal Slip Length at a L/S Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer (Caltech)


A new technical paper titled "Thermal Slip Length at a Liquid/Solid Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer" was published by researchers at California Institute of Technology, , T. J. Watson Sr. Laboratories of Applied Physics. Abstract "Specialty integrated chips for power intensive tasks like artificial intelligence generate so much heat ... » read more