Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.
Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
Chip Industry Week In Review
California SiC factory funding; IEDM announcements, including 2nm and 2D materials advances from Intel and TSMC, CFETs, and subtractive ruthenium metallization; Rapidus' new partnerships; Synopsys' 1.6 Tbps Ethernet IP; Micron's $6.1B DRAM fab grant; global IC sales set record; Lam's maintenance cobot; China ramps U.S. imports ahead of tariffs.
Chip Industry Week in Review
Next-gen EUV laser R&D; $285M CHIPS Act award; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron's $2B fab expansion; Tesla sales slump; USB-C mandate in Europe.
What’s Next For Through-Silicon Vias
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.
