The Week In Review: IoT

By Jeff Dorsch - 18 Aug, 2017 - Comments: 0

Connectivity Longing for LightSquared? The once-bankrupt company that tried to build a network with satellite airwaves and traditional spectrum has been reborn as Ligado Networks, which wants to serve 5G and Industrial Internet of Things applications with a mobile data network, employing satellite communications and other resources. Its founder is Philip Falcone, who was the guiding force behi... » read more

Next-Gen Botnets

By Ernest Worthman - 05 May, 2016 - Comments: 0

Botnets, once limited to computer networks, are expanding and changing as more devices are connected to the Internet—and becoming much harder to detect and destroy. The term botnet—a contraction for robotic networks—conjures up the days when it was just a collection of computers that were largely autonomous, on a local network and usually assigned to repetitive tasks. But that is chang... » read more

Short-Range, Low-Power Sensors

By Ernest Worthman - 09 Dec, 2014 - Comments: 1

Over the last 10 years the world has done a remarkably good job of connecting the global wireless world. This is partly because of visionaries, partly because of marketers, and partly just because we can, but mostly because of convenience. We now never need be to be off the wide-area interconnected highway. The last decade has radically changed the way we live. The smartphone and its cousin, th... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Thingbots

The Week In Review: IoT

Next-Gen Botnets

Short-Range, Low-Power Sensors