tag: TIE

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Synthesizing Hardware From Software
By Brian Bailey - 22 Aug, 2019 - Comments: 1

The ability to automatically generate optimized hardware from software was one of the primary tenets of system-level design automation that was never fully achieved. The question now is whether that will ever happen, and whether it is just a matter of having the right technology or motivation to make it possible. While high-level synthesis (HLS) did come out of this work and has proven to be... » read more

The Next Level Of Abstraction For System Design
By Frank Schirrmeister - 24 Sep, 2015 - Comments: 1

Recently there have been a lot of discussions again about the next level of design abstraction for chip design. Are we there yet? Will we ever get there? Is it SystemC? UML/SysML perhaps? I am taking the approach of simply claiming victory: Over the last 20 years we have moved up beyond RTL in various areas—just in a fragmented way. However, the human limitations on our capacity for processin... » read more

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