tag: Toray Industries

Chip Industry Week In Review

By The SE Staff - 07 Mar, 2025 - Comments: 0

The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Week In Review

By The SE Staff - 25 Oct, 2024 - Comments: 0

Europe's top court ruled in Intel's favor, voiding a $1.1 billion fine imposed by the European Union and dismissing charges of anti-competitive behavior. IBM released yield benchmarks for high-NA EUV, which serve as proof points that the newest advanced litho equipment will enable scaling beyond the 2nm process node. Also on the lithography front, Nikon is developing a maskless digital litho... » read more

Trending Articles

Chip Industry Week In Review

ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new security IP and algorithms; neuromorphic AI chip; adaptive MCUs; auto superbrains.

by The SE Staff

Chip Industry Week In Review

Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.

by The SE Staff

Challenges Grow For Medical ICs

Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination of low volume and high complexity.

by Gregory Haley

3D-IC For The Masses

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?

by Brian Bailey

Chip Industry Week In Review

Malaysia design deal with Arm; strong IC sales; Europe's HPC independence push; CHIPS Act clawback clause; Allegro spurns offer; TSMC $100B U.S. deal; Intel's chain of custody; Microchip restructures; auto RISC-V.

by The SE Staff

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