Week In Review: Manufacturing, Test

By Mark LaPedus - 13 Sep, 2019 - Comments: 0

Chipmakers and OEMs Delphi Technologies is in volume production with a 800 volt silicon carbide (SiC) inverter for next-generation electric and hybrid vehicles. The inverter extends electric vehicle (EV) ranges. It also halves the charging times compared with today's 400 volt systems. In a separate announcement, Delphi Technologies and Cree have announce a partnership to utilize SiC semicon... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 21 Sep, 2018 - Comments: 0

Tariffs The Office of the U.S. Trade Representative (USTR) has released a list of $200 billion worth of Chinese imports that will be subject to tariffs. These actions are on top of another set of tariffs, which were put in place. The additional tariffs will be effective starting Sept. 24, and initially will be in the amount of 10%. Starting Jan. 1, 2019, the level of the additional tariffs wi... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 15 Sep, 2017 - Comments: 0

Chipmakers Toshiba has changed its mind yet again about which group will buy its prized memory unit. On June 20, Toshiba chose a Japanese government-led consortium of INCJ/DBJ, Bain Capital and South Korea’s SK Hynix. Then, Toshiba changed its mind and selected a similar group with Western Digital (WDC), leaving SK Hynix on the outside looking in. This week, Toshiba signed a deal with a B... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing

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