How prepared the EDA community is to address upcoming challenges isn’t clear.
Advanced etch holds key to nanosheet FETs; evolutionary path for future nodes.
From specific design team skills, to organizational and economic impacts, the move to bespoke silicon is shaking things up.
Who’s doing what in next-gen chips, and when they expect to do it.
Is there about to be a major disruption in the EDA industry, coupled to the emerging era of domain specific architectures? Academia certainly thinks so.
New memory approaches and challenges in scaling CMOS point to radical changes — and potentially huge improvements — in semiconductor designs.
Details on more than $500B in new investments by nearly 50 companies; what’s behind the expansion frenzy, why now, and challenges ahead.
Manufacturability reaches sufficient level to compete with flip-chip BGA and 2.5D.
