As SiC moves to higher voltages, BEV users get faster charging, extended range, and lower system costs
Imec’s SVP drills down into GAA FETs, interconnects, chiplets, and 3D packaging.
Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.
Some segments are normalizing, others may be impacted through 2022.
Abstraction is the key to custom processor design and verification, but defining the right language and tool flow is a work in progress.
Some things will get better from a design perspective, while others will be worse.
Massive expansion campaign targets wide variety of chips, but export controls limit growth at leading edge.
Processing data in place can cut down on a lot of data movement, but the technology wasn’t there — until now.
