Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Oct, 2018 - Comments: 0

Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 03 Aug, 2018 - Comments: 0

Deals Arm acquired Treasure Data, which offers a data management service. Financial terms weren’t revealed, although the transaction is reportedly worth $600 million. Joyce Kim, Arm’s chief marketing officer, told reporters that the purchase is “the largest cash deal we’ve done.” Along with the company’s introduction of Mbed Cloud (a device management service) last year and the acq... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Aug, 2018 - Comments: 0

Arm acquired Treasure Data, a provider of enterprise data management solutions. Along with Mbed Cloud and the recent acquisition of Stream, which provides connectivity and device management, it will form the basis of Arm's new IoT management platform. Treasure Data was founded in 2011. Terms of the deal were not disclosed, although Bloomberg reported the price at $600 million. UltraSoC n... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Treasure Data

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored