Patently Absurd

By Brian Bailey - 29 Nov, 2018 - Comments: 2

One thing I like about the holiday season is that it gives me the opportunity to be a little less formal and have a little fun. I find humor within the patent system. I can remember growing up and being told that our next-door neighbor was crazy—but brilliant because he had a patent. Everyone looked to him as though he was a technology god. Later in life I learned how easy it is to get a p... » read more

Crazy Christmas Patents

By Brian Bailey - 22 Dec, 2016 - Comments: 0

For the past several years, I have been writing a blog that pokes fun at patent applications related to Christmas. It now appears that I am an expert in this subject matter because I received two e-mails during the course of this year. One asked how they should go about getting their Christmas ornament manufactured and marketed. The other asked if I would feature their newly released ornament i... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 06 May, 2016 - Comments: 0

Chipmakers Samsung has rolled out the Samsung Family Hub Refrigerator, an appliance that changes the landscape in the refrigerator market. The refrigerator comes with a 21.5-inch LCD touchscreen, which serves as the digital command center and connects to a smartphone. It enables consumers to view inside the fridge with a smartphone while grocery shopping. It can access music or television cont... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: U.S. Patent Office

Patently Absurd

Crazy Christmas Patents

The Week In Review: Manufacturing