Week In Review: IoT, Automotive & Security

By Susan Rambo - 03 Jan, 2020 - Comments: 0

Internet of Things Qorvo, the company whose products sent pictures back from Pluto and Arrokoth (formerly Ultima Thule) on New Horizons, is showing off a couple smart home, IoT products at CES 2020 in Las Vegas next week. The company says its new transceiver chip QPG7015M will simplify gateway IoT design because the chip can simultaneously handle all open, smart home protocols, including ZigBe... » read more

FAA Traffic Management Anticipates Flying Cars

By Kevin Fogarty - 17 Oct, 2018 - Comments: 0

It may be a year or more before the U.S. Federal Aviation Administration (FAA) changes its rules enough for Amazon or other hopefuls to deliver products by drones. But the five-year FAA Reauthorization Act of 2018, signed into law Oct. 5, confirmed controversial rules the FAA considers critical to its ability to regulate drone traffic and confirmed funding and plans for drone-specific additi... » read more

Anti-Drone Tech Emerges With Drone Growth

By Kevin Fogarty - 04 Oct, 2018 - Comments: 2

The ability of unmanned aerial vehicles to fly legally over fences, walls and property lines is disrupting more than just the few industries that use drones commercially. As the drone market grows, so does the anti-drone market. The market for products that track, trap or break unmanned aerial vehicles (UAV) is growing alongside the market for drones, much of it driven by fear that UAVs coul... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: UAS

Week In Review: IoT, Automotive & Security

FAA Traffic Management Anticipates Flying Cars

Anti-Drone Tech Emerges With Drone Growth

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