Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized interconnect solution for both CoWoS and InFO packaging technologies.
The GUC and proteanTecs collaboration started with GUC’s second generation of GLink, known as GLink 2.0. The project target was...
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