Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 23 Jul, 2021 - Comments: 0

Security Xilinx is investing an undisclosed amount in fabless semiconductor startup Kameleon Security, which is working on a cyber protection chip for servers, data centers, and cloud computing. The proactive Security Processing Unit (ProSPU) already secures the boot and has a root of trust (RoT). The chip will be demonstrated at the Open Compute Project (OCP) Global Summit, which is planned f... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 01 Mar, 2019 - Comments: 0

Internet of Things Yingzi Technology of Guangzhou, China, has developed a “future pig farm” to demonstrate what technology can do to make keeping pigs more profitable in a country that is trying to reduce the number of small farms raising pigs and consolidate them into larger operations. China is also contending with an outbreak of African swine fever that has spread out of the country thr... » read more

The Week In Review: Design/IoT

By Jesse Allen - 08 Apr, 2016 - Comments: 0

Tools Cadence unveiled the latest updates to its Virtuoso platform, adding enhanced data handling for up to 20X improvement in loading waveform databases in excess of 1GB and a 50X improvement in versioning and loading set-up files into the environment in the Analog Design Environment. Updates to the Layout Suite offer up to 100X accelerated zoom, pan, drag and draw performance on large layo... » read more

The Week In Review: Design/IoT

By Jesse Allen - 07 Aug, 2015 - Comments: 0

Tools Cadence unveiled Joules, its new RTL power analysis solution. The tool performs design synthesis using a new integrated prototype mode of Cadence's Genus Synthesis product, including physically aware clock tree and datapath buffering, and enabling accurate RTL power estimation. IP Synopsys and ASMedia completed a successful interoperability demonstration of Synopsys' USB 3.1 Devi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: UL

Week In Review: Auto, Security, Pervasive Computing

Week in Review: IoT, Security, Auto

The Week In Review: Design/IoT

The Week In Review: Design/IoT