November 2019 Startup Funding

By Jeff Dorsch - 05 Dec, 2019 - Comments: 0

During November, 16 tech startups raised private funding rounds of $100 million or more, together receiving $3.42 billion. Investors were drawn to many of the same technology fields that were popular in 2019 — automotive and mobility tech, artificial intelligence and machine learning, cybersecurity, platforms, semiconductors, and software. Analytics of multiple different types were big in ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 17 May, 2019 - Comments: 0

Internet of Things Verizon Communications launched its nationwide narrowband Internet of Things network, saying it covers more than 92% of the U.S. population. “There is a whole universe of smart solutions needing scalable and affordable connections,” Jeffrey Dietel, senior vice president of business marketing and products, said in a statement. “By launching our NB-IoT network, Verizon i... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 22 Mar, 2019 - Comments: 0

Internet of Things Second-tier cities in the U.S. that can’t attract projects like the Amazon HQ2 are welcoming the testing of autonomous vehicles, smart city technology, and advanced surveillance techniques, this analysis notes. What do they get in return? Much of the time, little or nothing. And bad things can happen. People have been throwing objects at Waymo vehicles in Chandler, Ariz., ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 01 Mar, 2019 - Comments: 0

Internet of Things Yingzi Technology of Guangzhou, China, has developed a “future pig farm” to demonstrate what technology can do to make keeping pigs more profitable in a country that is trying to reduce the number of small farms raising pigs and consolidate them into larger operations. China is also contending with an outbreak of African swine fever that has spread out of the country thr... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: United Arab Emirates

November 2019 Startup Funding

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored