tag: University of Genova

Research Bits: July 8

By Liz Allan - 08 Jul, 2024 - Comments: 0

2D TFETS for neuromorphic computing Researchers from the University of California Santa Barbara and Intel Labs used 2D transition metal dichalcogenide (TMD)-based tunnel-field-effect transistors (TFETs) in a neuromorphic computing platform, bringing the energy requirements to within two orders of magnitude (about 100 times) the amount used by the human brain. The 2D TFETs have lower off-sta... » read more

Trending Articles

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Chip Industry Week In Review

Infineon’s 300mm power GaN wafer; SIA’s state of the industry report; India’s IC buzz; mandatory AI reporting; conference announcements; secure chips for space.

by The SE Staff

Defect Challenges Grow At The Wafer Edge

Better measurement of edge defects can enable higher yield while preventing catastrophic wafer breakage, but the number of possible defects is increasing.

by Laura Peters

New Materials Are in High Demand

Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a complex process.

Knowledge Centers
Entities, people and technologies explored

Related Articles

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

by Jesse Allen

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

CPU Performance Bottlenecks Limit Parallel Processing Speedups

Hardware optimizations and well-thought-out software architectures can help, but only incrementally.

by Bryon Moyer

When To Expect Domain-Specific AI Chips

With the intended application evolving faster than silicon can be developed, optimizing hardware becomes a delicate balance.

by Brian Bailey

IC Industry’s Growing Role In Sustainability

Addressing energy consumption has become a requirement as AI takes root, but it requires changes across the entire ecosystem.

by Ann Mutschler

Fantastical Creatures

Why HLS is critical for determining which type of processors to use.

by Russell Klein

Heat-Related Issues Impact Reliability In Advanced IC Designs

Retaining data in memories and processors becomes more difficult as temperatures rise in advanced packages and under heavy workloads.

by Ann Mutschler

Temperature: A Growing Concern For Chip Security Experts

It used to be a lab-based threat, but heat is emerging as a real attack vector.

by Adam Kovac

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2024 SMG | Terms of Service | Privacy Policy